Simpie and speedy manual visual inspection of 300mm wafers. Contributes to dramatic increases in yields as an inline inspection system and analysis tool for backend process
Simpie and speedy manual visual inspection of 300mm wafers.Contributes to dramatic increases in yields as an inline inspection system and analysis tool for backend process.
• budget tool. • Available for 8" and 12" wafer inspection. • High resolution wafer surface and backside macro capture function. • FOUP/FOSB handle. • Large area and high brightness macro illuminator. • available for Z axis measurement(bump height,particle height…..). • 5 million pixes digital CCD camera with measurement software.